Soldering Flux ZHJ-202

Product Introduction:Copper and tin are different metal materials,and their physical and chemical properties are different largerly, copper and liquid tin can not be well bonded together, that is, copper wire tinning does not rely on the role of external chemical media,tin will not be uniformly and firmly plated on the surface of copper wire, After the contact between the flux and the metal copper tin,the activity between the two will be stimulated, so in the process of copper wire tinning, if the surface of the copper wire is coated with a layer of flux,it can achieve the purpose of uniform and firm tin plating. 

Scope of Application:Continuous tinning process for bare copper wire

Product Features:Good solderability and uniform tin plating

Product Appearance:Transparent liquid

Storage Conditions:Ventilation, drying, room temperature

Shelf Life:Half year

Product Packaging:35kg

Main Technical Parameters: Omit